Attachment 1: Request for Information Microelectronics Sourcing
Updated
A Word document (32 KB) attached to Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2), from the Department of the Army. Due Oct 27, 2026, 1:00 PM (UTC-4).
File name: Attachment 1 - Request for Information Microelectronics Sourcing.docx
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REQUEST FOR INFORMATION (RFI) / SOURCES SOUGHT
Agency: Department of the Army Office: Army Contracting Command (ACC) Notice Type: Request for Information (RFI) / Sources Sought Subject: High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains Classification Code: 5961 (Semiconductor Devices and Associated Hardware) / 5962 (Microcircuits, Electronic) NAICS Code(s): 334413 (Semiconductor and Other Electronic Component Manufacturing) / 334419 (Other Electronic Component Manufacturing)
1.0 PURPOSE AND SCOPE
The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration. The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols. Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.
2.0 BACKGROUND & STRATEGIC OBJECTIVES
Microelectronics represent mission-critical components in modern defense, communications, and munitions systems. In alignment with recent National Defense Authorization Acts (NDAA), DoD Instruction (DoDI) 5200.50 (Assured Access to Trusted Microelectronics), and DFARS 252.246-7007/7008, the Department of the Army requires verified supply chain integrity, assured traceability, and continuous volume availability. Tobyhanna Army Depot (TYAD) and Army Contracting Command (ACC) seeks to partner directly with manufacturers and primary Tier-1 distributors who possess dedicated fabrication capacity, proactive obsolescence mitigation programs, and robust anti-counterfeiting controls.
3.0 REPRESENTATIVE HIGH-VOLUME COMPONENT PROFILES
The Government requires sustained procurement of active, passive, and power-management components in production quantities ranging from hundreds of thousands to multi-million-unit annual runs.
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