Bid document
Updated
A PDF document (102 KB) attached to Request for Information: Flexoelectric Future, from the Defense Advanced Research Projects Agency (DARPA). Due Dec 4, 2026.
File name: DARPA-SN-27-10.pdf
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DARPA-SN-27-10
Special Notice
Request for Information:
Flexoelectric Futures
DARPA-SN-27-10
November 4, 2026
Defense Advanced Research Projects Agency
Multi X Office
675 North Randolph Street
Arlington, VA 22203-2114
DARPA-SN-27-10
Request for Information (RFI)
Special Notice DARPA-SN-27-10
Flexoelectric Futures
Defense Advanced Research Projects Agency (DARPA)
Multi X Office (MXO)
OVERVIEW:
Posting Date: November 4, 2026
Responses Due: December 4, 2026, at 2:00 p.m. Eastern Time (ET) Technical POC: Dr. David Meyer, MXO Program Manager
E-mail: [email protected]
RFI DESCRIPTION:
The Defense Advanced Research Projects Agency (DARPA) Multi X Office (MXO) seeks information to inform possible future research on flexoelectric materials. The Department of War (DoW) requires sensing and transduction technologies that operate under size, weight, power, communications, and environmental constraints. The intended scope of this RFI is to explore foundational materials, interfaces, metrology, design rules, and device elements that may encode or discriminate local mechanical state through strain-gradient-driven electromechanical response. Responses may identify how materials and device elements could support future distributed sensing, adaptive transduction, physical-compute device elements, morphological-compute systems, or compliant robotic structures; however, reference to these applications is not required. The goals of this Request for Information (RFI) include, but are not limited to: •
Surveying the state of the art in flexoelectric, strain-gradient-driven, and related electromechanical materials and devices
•
Identifying and distinguishing the intrinsic, interfacial, ionic, defect-mediated, phase-boundary, electrode, and geometry-driven mechanisms that govern observed flexoelectric response
•
Identifying material, microstructure, interface, and device architectures that provide highresponse, low-loss, compliant, and stable strain-gradient transduction
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Identifying figures of merit, benchmarking methods, and preliminary quantitative estimates that enable credible comparison with piezoelectric, capacitive, triboelectric, soft-sensor, and other relevant approaches
•
Identifying device elements that encode or distinguish mechanically relevant conditions, including bend, impact, contact, vibration, slip, fatigue, damage, and load
•
Identifying material and device requirements for future distributed sensing, adaptive transduction, physical-compute device elements, morphological-compute systems, and bodylevel reflex applications
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