Request for Information for Advancing Critical and Emerging Microelectronics Technologies

Request for Information (RFI) for Advancing Critical and Emerging Microelectronics Technologies

I. Background Information

The United States is in a battle for global leadership in the critical and emerging technologies that will drive decades of national and economic security and prosperity. To ensure U.S. global dominance in the industries of the future, we seek to advance the nation’s stated agenda to secure the U.S. position as the unrivaled world leader in emerging technology. As the nation’s premier laboratory with a mission to promote U.S. innovation and industrial competitiveness, Sandia National Laboratories (SNL) is poised to work with industry at every step to support U.S. manufacturing and technological capacity in critical and emerging microelectronics technologies.

The basis for this RFI is aligned with the goal of advancing technology leadership in the United States and strengthening the supply chain for domestic semiconductor manufacturing.

II. Opportunity Description and Areas of Interest

The following are general topic areas that have been identified as priority areas for proposals under this RFI:

Semiconductors. Proposed projects may include conducting research and prototyping of advanced semiconductor technologies to strengthen the economic competitiveness and security of the domestic supply chain, overcome R&D ecosystem gaps, and develop innovative advanced technologies, including but not limited to:

Microelectronic/Semiconductor Devices:

Analog and Digital Signal Processing and Computing Technologies Includes neuromorphic, energy efficient artificial intelligence hardware, analog, digital and mixed signal processing, next generation memory technologies Power Electronics
GaN/AlGaN/AlN, Diamond, SiC, and Ga2O3
Magnetic and dielectric materials (including integrated magnetics and dielectrics), Advanced Sensing and Timing
Materials, devices, architectures, detectors, systems, read out integrated circuits, and atomic clocks Communications Technologies
Radio frequency, optoelectronic/photonic, quantum

Miroelectronics fabrication and characterization capability:

Advanced test, assembly, and packaging capability in the domestic ecosystem. Heterogeneous integration and 3D packaging, chiplets, 3D stacking, novel memory architectures, 2.5D packaging, integrated photonic packages, ultrahigh density interposers, and next generation assembly and systems packaging. Materials characterization, instrumentation, and testing for next generation microelectronics.